Universal thermal conductive silicone pad

Universal thermally conductive silicone pads are thermal interface materials that combine high thermal conductivity with flexibility, suitable for the heat dissipation needs of various electronic devices. The products feature low thermal resistance, self-adhesive surface, and good conformability, ensuring stable contact and efficient heat conduction during assembly. Their low hardness and high compression ratio effectively reduce assembly stress, making them suitable for structural designs with large tolerances.

Category:

Product Advantages:

1) Low thermal resistance

2) Self-adhesive surface, stable and conformable fit

3) Low hardness, high compression ratio, suitable for low-stress assembly

4) High cost-effectiveness

Property Unit Test Method Test Result
Color Visual Check Gray
Thickness mm ASTM D374 0.3–12
Hardness Shore C ASTM D2240 20–60
Specific Gravity g/cm³ ASTM D792 2.0–4.0
Tear Strength KN/m ASTM D412 ≥0.8
Operating Temperature EN344 –40 to +200
Breakdown Voltage KV ASTM D149 ≥4
Volume Resistivity Ω·cm ASTM D257 1.1 × 10¹⁵
Thermal Conductivity W/m·K ASTM D5470 1.2–15.0
Flammability Rating UL-94 V-0

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